3D Packaging

Alpha Advanced Materials offers a full line of industry leading solder fluxing and alloy performance materials for the next generation semiconductor packaging applications.  The latest range of Alpha paste fluxes, solder spheres and solder pastes are all designed and formulated to meet the industries requirements for next generation packaging.

Alpha Advanced Materials'  product line offerings include low-Ag alloys, halogen-free fluxing technologies, higher thermal cycling and drop resistance alloys combine to deliver higher activity and better reliability for your high volume manufacturing needs.

Alpha Advanced Materials fluxes are formulated using the latest flux technology to provide universal soldering performance for flip chip and wafer level processing. Our newest line of fluxes offer ultra low no-clean residue for Copper Pillar thermo-compression bonding (TCB) applications for convention flip chip reflow to 3D stacking processes. 

Alpha Advanced Materials next generation high reliability alloys employ advanced metallurgy technologies for all of your solder hierarchy needs; providing high-reliability spheres in the standard SAC, low and mid-range alloy temperature segments.  The latest range of Alpha® spheres and alloys such as Maxrel PlusTM or SBX02TM for solder paste help assure alloy-to-alloy compatibility providing stronger more reliable solder joints.  All of Alpha Advanced Materials solder pastes and spheres conform to our customers’ unique processes, as well as the challenging environmental regulations they are required to follow.


Liquid Flux


Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Dispense Print Dip Spray Halide Free Activity Tackiness Low Residue
WS3018-FS Water Soluble   o     o   Hi Lo   FCCSP


Paste flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Vicosity Tackiness
NCX-390 No Clean o   o o Hi Med Hi BGA/FCCSP
NCX402-M3 No Clean
  o o Hi Med Hi BGA/FCCSP
WS9160-M7 Water  Soluble o o o Hi Med Hi BGA/wafer


Solder paste

Product Name Material Type Deposition Method Properties Powder Size Component Type
Dispense Print Dip Halide Free Activity Tackiness Fine Pitch Capable Lead Free Type 3 Type 4 Type 5 Type 6
WS609 Water Soluble   o   o Hi Hi   o o o     SiP/BGA
WS693CPS   o   o Hi Hi o o   o o o SiP/BGA
WS698CPS   o   o Hi Hi o o       o SiP/BGA


Sphere

 

 

Alloy

Elemental Composition

Melting Point (C)

 

Atttribute

Tin (Sn)

Lead (Pb)

Silver (Ag)

Copper (Cu)

Nickel (Ni)

Bismuth (Bi)

 

Eutectic

 

Solidus

 

Liquidus

 

Tin- Lead

Sn63/Pb37

63

37

-

-

-

-

183

-

-

Eutectuc Tin-lead

Sn62/Pb36/Ag2

62

36

2

-

-

-

179

-

-

Eutectuc Tin-lead Silver

 

 

 

 

 

Lead Free

SAC105

98.5

-

1

0.5

-

-

 

217

228

 

Industry standard low silver alloy

SAC125 w/Ni

98.3

-

1.2

0.5

250-500
ppm

-

 

217

228

SAC305

96.5

-

3

0.5

-

-

 

217

221

Industry stardard lead free

SAC405

95.5

-

4

0.5

-

-

 

217

225

Industry stardard lead free

Sn96.5/Ag3.5

96.5

-

3.5

-

-

-

221

-

-

Industry stardard lead free

Sn42/Bi57.6/Ag0.4

42

-

0.4

-

-

57.6

 

 

138

Lead free low melting point

SACX0307

98.9

-

0.3

0.7

-

0.1

 

217

228

Best in class drop shock reliability

SACX0307 Plus

98.9

-

0.3

0.7

 

0.1

 

217

228

MaxRel

 

Proprietary

212 220

Best in class thermal cycle reliability and drop shock
performance

MaxRel Plus

209 220

 

HRL1

138 151

Best in class thermal cycle reliability and drop shock
low temperature alloy

  
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