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High Thermal Conductivity Die Attach Film
ATROX CF200-1D high thermal and electrical conductivity film is designed for die attach assembly of semiconductor packages. The film offers excellent bond-ability to a variety of leadframe surfaces and die sizes with no resin bleed out (RBO). The bondline thickness is controlled accurately with no die tilting issues resulting in high yield assembly. The low outgassing property of the film ensures superior reliability and Moisture Sensitivity Level (MSL) performance.
Hybrid Silver Sintering Die Attach
The ATROX 800HT Series is a thermosetting conductive die attach adhesive with high thermal conductivity (>100 W/m-K) designed for high power semiconductors and exposed pad semiconductor packages. It has excellent adhesive strength to NiPdAu, Ag and MEP leadframes, low out gassing, which minimizes oven contamination, and is ideal for excellent MSL performance.
Sintered Die Attach
Advanced sinter and solder solutions addressing a wide variety of challenges for power electronics. Our engineered sinter materials are proven to enable high throughput and reliability while providing flexible and easy-to-use form factors that reduce the capital cost and accelerate time to market.
View Products in Die Attach
- Argomax® 2141
Argomax 2141 Paste is a silver sinter paste for large package sinter attachment, specifically for marginalized component surfaces that are designed for component placement on wet paste with high tack.
- Application: Package/Module Attach. Substrate Attach
- Specifically formulated for large area dispense on Ag/Au surfaces
- Designed for component placement on wet paste with high tack
- Pure Silver bond line for high performance ensuring excellent performance plus thermal and electrical conductivity, and overall reliability
- Low sintering pressure for critical applications, enabling for high yield manufacturing and installation of leaner processes
- Design allows for thick dispense volumes providing bond lines suitable for large areas
- Flexible bondline thickness
- ATROX® 800HT5
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements.
- High thermal conductivity > 70 W/m-K
- Lower stress material for mid to larger size die packages (< 50mm2).
- Compatible with multiple leadframe surfaces: Ag, Cu & PPF (NiPdAu).
- ATROX® 800HT2V
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements.
- Very high thermal conductivity > 130 W/m-K
- Moderate stress material for small to mid size die packages.
- Compatible with multiple leadframe surfaces: Ag, Cu & PPF (NiPdAu).
- ATROX® 850HT1
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements.
- High thermal conductivity > 200 W/m-K
- High power semiconductor packages.
- Low resin bleed out.
- Low condensable organics.
- ATROX® CF100-7B
The ATROX brand of conductive die attach films are designed to provide you with superior performance for today's stringent reliability requirements.
- Excellent thermal conductivity > 10 W/m-K
- Produces high thermal and electrical conductivity silver bonds with conventional die attach film processes.
- Can be laminated on wafer backside with moderate temperatures (< 100C).
- ATROX® CF200-1D
The ATROX brand of conductive die attach films are designed to provide you with superior performance for today's stringent reliability requirements.
- ATROX CF200-1D is a conductive film adhesive with high electrical and thermal conductive properties.
- The unique chemistry allows excellent process flexibility and superior reliability performance to a variety of die sizes used for semiconductor applications.
- ALPHA® Argomax® 8020 Film
Sinter Silver Film for Die Attachment
- Die-Transfer-Film (DTF) process
- Designed for Ag/Au surfaces
- Customized for fast and easy die and spacer lamination
- Pure silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Die attach temperatures suitable for semiconductor manufacturing
- ALPHA® Argomax® 2047 Paste
Sinter Silver Paste for Package Sinter Attachment
- Application: Package/Module Attach, Substrate Attach
- Formulated for printing on Ag/Au surfaces
- Designed for component placement on wet paste with high tack
- Pure Silver bond line for high performance (thermal and electrical conductivity) and reliability
- Flexible bond line thickness
- Low sintering pressure for high yield manufacturing
- ALPHA® Argomax® 2048 Paste
Sinter Silver Paste for Package Sinter Attachment
- Application: Package/Module Attach, Substrate Attach
- Formulated for large area dispense on Ag/Au surfaces
- Designed for component placement on wet paste with high tack
- Pure Silver bond line for high performance (thermal and electrical conductivity) and reliability
- Low sintering pressure for high yield manufacturing
- Design allows for thick dispense volumes providing bond lines suitable for large areas
- Flexible bondline thickness
- ALPHA® Argomax® 5022 Paste
Sinter Silver Paste for Die Attachment on Copper Surface
- Application: Die Attach, Die Top Attach
- Formulated for printing on Cu surfaces
- Designed for die placement on dried paste
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
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