Sphere Attach

In BGA/CSP package assembly, the solder ball attach process is one of the major yield points that impacts the overall product yield and cycle time because it is the last process step to form electrical and mechanical connection to  the complete package.

The most popular ball attach technology in the industry is the use of pin transfer using paste flux and  solder sphere . Alpha provides industry leading fluxing technolgoy for 100% first pass yield for sphere attach process on ENIG, ENEPIG and CuOSP pad finishes.  Alpha sphere attach solutions demonstrate superior solder ball coplanarity, solder ball height, solder ball diameter and high solder ball shear for robust process yields even on poor surface conditions

 

Paste Flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Vicosity Tackiness
NCX PRL-507 Epoxy
o
  Lo Hi Hi Wafer
WS600-MHV Water  Soluble o o o o Hi Hi Hi BGA/wafer
WS9180-MHV o o o o Hi Hi Hi BGA/wafer
WS9160-M7 o o o o Hi Med Hi BGA/wafer
WSX-HF-HAHV o o o o Hi Hi Hi BGA/wafer


Sphere

 

 

Alloy

Elemental Composition

Melting Point (C)

 

Atttribute

Tin (Sn)

Lead (Pb)

Silver (Ag)

Copper (Cu)

Nickel (Ni)

Bismuth (Bi)

 

Eutectic

 

Solidus

 

Liquidus

 

Tin- Lead 

Sn63/Pb37

63

37

-

-

-

-

183

-

-

Eutectuc Tin-lead

Sn62/Pb36/Ag2

62

36

2

-

-

-

179

-

-

Eutectuc Tin-lead Silver

 

 

 

 

 

Lead Free 

SAC105

98.5

-

1

0.5

-

-

 

217

228

 

Industry standard low silver alloy

SAC125 w/Ni

98.3

-

1.2

0.5

250-500
ppm

-

 

217

228

SAC305

96.5

-

3

0.5

-

-

 

217

221

Industry stardard lead free

SAC405

95.5

-

4

0.5

-

-

 

217

225

Industry stardard lead free

Sn96.5/Ag3.5

96.5

-

3.5

-

-

-

221

-

-

Industry stardard lead free

Sn42/Bi57.6/Ag0.4

42

-

0.4

-

-

57.6

 

 

138

Lead free low melting point

SACX0307

98.9

-

0.3

0.7

-

0.1

 

217

228

Best in class drop shock reliability

SACX0307 Plus

98.9

-

0.3

0.7

 

0.1

 

217

228

MaxRel

 

Proprietary

212 220

Best in class thermal cycle reliability and drop shock
performance

MaxRel Plus

209 220

 

HRL1

138 151

Best in class thermal cycle reliability and drop shock
low temperature alloy

  
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