Wafer Bump

Wafer level packaging provides the smallest form factor in packaging technology. 

Whether it is mobile electronic devices or high performance devices, there is a demand for the smallest, lightest devices that can also offer the highest performance and reliability.

Wafer bumping technology provide high performance, form factor and cost advantages in a smallest semiconductor package.

The solder bumps used in wafer level packaging  need to demonstrate both high electrical and high mechanical reliability during the lifetime of the product. Alpha Solder spheres, Paste fluxes offer industry leading wafer ball attach solution to meet those requirement. Alpha liquid fluxes provide robust wafer bump reforming processes for wafer bumping applications that utilize electroplated solder bumping processes.

 

Paste Flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Vicosity Tackiness
WS600-MHV Water  Soluble o o o o Hi Hi Hi BGA/wafer
WS9180-MHV o o o o Hi Hi Hi BGA/wafer
WSX-HF-HAHV o o o o Hi Hi Hi BGA/wafer
WS9160-M7 o o o o Hi Med Hi BGA/wafer

 

Liquid Flux

Product Name Material Type Deposition Method Properties Component Type
Dispense Spray Dip Halide Free Activity Tackiness Low Residue
 NR310B No Clean o o

Lo Lo
wafer
OA5304HF Water  Soluble o o
o Hi Hi o wafer
OA1303 o o
o Hi Hi o wafer


Sphere

 

 

Alloy

Elemental Composition

Melting Point (C)

 

Atttribute

Tin (Sn)

Lead (Pb)

Silver (Ag)

Copper (Cu)

Nickel (Ni)

Bismuth (Bi)

 

Eutectic

 

Solidus

 

Liquidus

 

Tin- Lead 

Sn63/Pb37

63

37

-

-

-

-

183

-

-

Eutectuc Tin-lead

Sn62/Pb36/Ag2

62

36

2

-

-

-

179

-

-

Eutectuc Tin-lead Silver

 

 

 

 

 

Lead Free 

SAC105

98.5

-

1

0.5

-

-

 

217

228

 

Industry standard low silver alloy

SAC125 w/Ni

98.3

-

1.2

0.5

250-500
ppm

-

 

217

228

SAC305

96.5

-

3

0.5

-

-

 

217

221

Industry stardard lead free

SAC405

95.5

-

4

0.5

-

-

 

217

225

Industry stardard lead free

Sn96.5/Ag3.5

96.5

-

3.5

-

-

-

221

-

-

Industry stardard lead free

Sn42/Bi57.6/Ag0.4

42

-

0.4

-

-

57.6

 

 

138

Lead free low melting point

SACX0307

98.9

-

0.3

0.7

-

0.1

 

217

228

Best in class drop shock reliability

SACX0307 Plus

98.9

-

0.3

0.7

 

0.1

 

217

228

MaxRel

 

Proprietary

212 220

Best in class thermal cycle reliability and drop shock
performance

MaxRel Plus

209 220

 

HRL1

138 151

Best in class thermal cycle reliability and drop shock
low temperature alloy

  
*
(Press ctrl to select multiple)
*