Automotive

Our goal is to help you improve automotive electronics reliability reduce your warranty costs.

 

The automotive industry is rapidly increasing its use of electronics to enhance the safety, comfort, performance and overall enjoyment of the driving experience. As a result of longer vehicle warranty periods, automobile manufacturers are demanding higher reliability, improved manufacturing efficiency and vastly reduced warranty failures, from all of their Tier 1 suppliers. Alpha is committed to meeting this challenge with groundbreaking electronic packaging and assembly materials, cutting edge research and development and our dedicated global application and technical engineering experts and strategically located labs.

Conductive Polymer

Product Name Format Deposition Method Property Application
Water Lamination Pick & Place Dispense Print Reworkable  Thermal  (W/m-k) Tg 
POLYSOLDER SE3001 Paste     o o   Medium Mid Substrate attach, DCA. COB attach, Lid seal


Non Conductive Polymer

Product Name Format Deposition Method Reworkable  Application
Water Lamination Pick & Place Dispense Spin Coat Dippable Print
STAYCHIP® F6142 Paste     o     o   Lid attach, 


Conductive Die Attach

Product Name Format Deposition Method Thermal (W/m-k) Key Features Component Type
Water Lamination Dispense Print Bare Silicon Compatibility Modulus
ATROX®
800HT2V
Paste   o o Extreme   Mid QFN, SO, TO, TSSO, Cu Clip
ATROX®
800HT7A
Paste   o o High o Low QFP, QFN, LGA, SO, BGA 
ATROX®
800HT5
Paste   o   High o Low QFN, SO, TO, TSSO, LGA, QFP
ATROX®
850HT1
Paste   o   Extreme o Mid QFN, BGA, SO, TO


Solder paste

Product Name Material Type Deposition Method Properties Powder Size Component Type
Dispense Print Dip Halide Free Actiivty Tackiness Fine Pitch Capable Lead Free Type 3 Type 4 Type 5 Type 6
NCP-390 No Clean   o   o Hi Hi o o   o o o SiP/BGA
WS693CPS Water Soluble   o   o Hi Hi o o   o o o SiP/BGA
WS698CPS Water Soluble   o   o Hi Hi o o       o SiP/BGA


Sphere

 

 

Alloy

Elemental Composition

Melting Point (C)

 

Atttribute

Tin (Sn)

Lead (Pb)

Silver (Ag)

Copper (Cu)

Nickel (Ni)

Bismuth (Bi)

 

Eutectic

 

Solidus

 

Liquidus

 

Tin- Lead

Sn63/Pb37

63

37

-

-

-

-

183

-

-

Eutectuc Tin-lead

Sn62/Pb36/Ag2

62

36

2

-

-

-

179

-

-

Eutectuc Tin-lead Silver

 

 

 

 

 

Lead Free

SAC105

98.5

-

1

0.5

-

-

 

217

228

 

Industry standard low silver alloy

SAC125 w/Ni

98.3

-

1.2

0.5

250-500
ppm

-

 

217

228

SAC305

96.5

-

3

0.5

-

-

 

217

221

Industry stardard lead free

SAC405

95.5

-

4

0.5

-

-

 

217

225

Industry stardard lead free

Sn96.5/Ag3.5

96.5

-

3.5

-

-

-

221

-

-

Industry stardard lead free

Sn42/Bi57.6/Ag0.4

42

-

0.4

-

-

57.6

 

 

138

Lead free low melting point

SACX0307

98.9

-

0.3

0.7

-

0.1

 

217

228

Best in class drop shock reliability

SACX0307 Plus

98.9

-

0.3

0.7

 

0.1

 

217

228

MaxRel

 

Proprietary

212 220

Best in class thermal cycle reliability and drop shock
performance

MaxRel Plus

209 220

 

HRL1

138 151

Best in class thermal cycle reliability and drop shock
low temperature alloy

  
*
(Press ctrl to select multiple)
*