Medical

Our goal is to help you improve your Medical packages and assemblies reliability, reduce your costs and increase efficiency.

 

For vital operations, Alpha Advanced Materials has developed packaging materials that exhibit high reliability and performance.  Common problems, such as stray particles and moisture are minimized and /or eliminated with our advanced products.  Alpha technologies allow for improved operational control with increased relaibility. Alpha Advanced Materials’ innovations for medical applications include: moisture, particle and CO2 getters, solder pastes, fluxes, re-workable thermal plastic adhesives and films.

Getter

Product Name Format Deposition Method Activation Require Getter Type Application
Pick & Place Dispense Print Hydrogen Moisture Particle
HiCap™
2000
Paste   o o     o   Hi Rel Hermetic Packages: Military, Defense, Telecom and Medical
STAYDRY®
H2- 3000
Film o      o  o  o   Hi Rel Hermetic Packages: Defense, Military, Aerospace, Telecom
STAYDRY® Z20 Film o      o    o   Hi Rel Hermetic Packages: Military, Defense, Aerospace and Telecom


Solder Paste

Product Name Material Type Deposition Method Properties Powder Size Component Type
Dispense Print Dip Halide Free Activty Tackiness Fine Pitch Capable Lead Free Type 3 Type 4 Type 5 Type 6
NCP1213 No Clean o     o Hi Hi     o       Leadframe
NCP-390   o   o Hi Hi o o   o o o SiP/BGA
WS693CPS Water Soluble   o   o Hi Hi o o   o o o SiP/BGA
WS698CPS   o   o Hi Hi o o   o SiP/BGA
WS699CPS   o   o Hi Hi o o   o SiP/BGA


Conductive Polymer

Product Name Format Deposition Method Property Application
Water Lamination Pick & Place Dispense Print Reworkable  Thermal  (W/m-k) Tg 
STAYSTIK® 571 Film o o     o Low Low Substrate, backplane attatch
STAYSTIK® 581 Film o o     o Low Mid Substrate, back plane attach


Spheres

 

 

Alloy

Elemental Composition

Melting Point (C)

 

Atttribute

Tin (Sn)

Lead (Pb)

Silver (Ag)

Copper (Cu)

Nickel (Ni)

Bismuth (Bi)

 

Eutectic

 

Solidus

 

Liquidus

 

Tin- Lead

Sn63/Pb37

63

37

-

-

-

-

183

-

-

Eutectuc Tin-lead

Sn62/Pb36/Ag2

62

36

2

-

-

-

179

-

-

Eutectuc Tin-lead Silver

 

 

 

 

 

Lead Free

SAC105

98.5

-

1

0.5

-

-

 

217

228

 

Industry standard low silver alloy

SAC125 w/Ni

98.3

-

1.2

0.5

250-500
ppm

-

 

217

228

SAC305

96.5

-

3

0.5

-

-

 

217

221

Industry stardard lead free

SAC405

95.5

-

4

0.5

-

-

 

217

225

Industry stardard lead free

Sn96.5/Ag3.5

96.5

-

3.5

-

-

-

221

-

-

Industry stardard lead free

Sn42/Bi57.6/Ag0.4

42

-

0.4

-

-

57.6

 

 

138

Lead free low melting point

SACX0307

98.9

-

0.3

0.7

-

0.1

 

217

228

Best in class drop shock reliability

SACX0307 Plus

98.9

-

0.3

0.7

 

0.1

 

217

228

MaxRel

 

Proprietary

212 220

Best in class thermal cycle reliability and drop shock
performance

MaxRel Plus

209 220

 

HRL1

138 151

Best in class thermal cycle reliability and drop shock
low temperature alloy

  
*
(Press ctrl to select multiple)
*