Mobile/Wireless

Increasing high volume production efficiencies to help improve the overall mobile / wireless package reliability to reduce costs.

 

Bring your most innovative designs to market with the lightweight strength and reliability that only Alpha performance materials can provide.  Our comprehensive experience on the assembly line, combined with intensive research and development, has resulted in the customized solutions for today complex package assemblies.  Alpha’s innovations for Mobile / Wireless package applications include: solder pastes, fluxes, die adhesives, and re-workable adhesive pastes and films.

Conductive Die Attach

Product Name Format Deposition Method Thermal (W/m-k) Key Features Component Type
Water Lamination Dispense Print Bare Silicon Compatibility Modulus
ATROX®
800HT2V
Paste   o o  Extreme
Mid QFN, SO, TO, TSSO, Cu Clip
ATROX®
558- 2C31
Paste   o   Low o Low QFN, SO, BGA, QFP, TSSO, LGA
ATROX®800HT5
Paste   o
High o Low QFN, SO, TO, TSSO, LGA, QFP
ATROX®HT7A1
Paste   o o High o Low QFN, SO, TO, TSSO, LGA, QFP


Conductive Polymer

Product Name Format Deposition Method Property Application
Water Lamination Pick & Place Dispense Print Reworkable  Thermal  (W/m-k) Tg 
STAYSTIK® 8000 Film o o       Low High Low Temp lamination, substrate, backplane attach


Getter

Product Name Format Deposition Method Activation Require Getter Type Application
Pick & Place Dispense Print Hydrogen Moisture Particle
HiCap™
2000
Paste   o o     o   Hi Rel Hermetic Packages: Military, Defense, Telecom and Medical


Paste flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Vicosity Tackiness
NCX-390 No Clean o   o o Hi Med Hi BGA/FCCSP
NCX-402-M3     o o Hi Med Hi BGA/FCCSP
NCX PRL-507 Epoxy
o
  Lo Hi Hi Wafer
WS9160-M7 Water  Soluble o o Hi Med Hi BGA/wafer
WSX-HF-HAHV o o o o Hi Hi Hi BGA/wafer


Solder paste

Product Name Material Type Deposition Method Properties Powder Size Component Type
Dispense Print Dip Halide Free Actiivty Tackiness Fine Pitch Capable Lead Free Type 3 Type 4 Type 5 Type 6
WS693CPS Water Soluble   o   o Hi Hi o o   o o o SiP/BGA
NCP390 NoClean   o   o Hi Hi o o   o o o SiP/BGA


Sphere

 

 

Alloy

Elemental Composition

Melting Point (C)

 

Atttribute

Tin (Sn)

Lead (Pb)

Silver (Ag)

Copper (Cu)

Nickel (Ni)

Bismuth (Bi)

 

Eutectic

 

Solidus

 

Liquidus

 

Tin- Lead

Sn63/Pb37

63

37

-

-

-

-

183

-

-

Eutectuc Tin-lead

Sn62/Pb36/Ag2

62

36

2

-

-

-

179

-

-

Eutectuc Tin-lead Silver

 

 

 

 

 

Lead Free

SAC105

98.5

-

1

0.5

-

-

 

217

228

 

Industry standard low silver alloy

SAC125 w/Ni

98.3

-

1.2

0.5

250-500
ppm

-

 

217

228

SAC305

96.5

-

3

0.5

-

-

 

217

221

Industry stardard lead free

SAC405

95.5

-

4

0.5

-

-

 

217

225

Industry stardard lead free

Sn96.5/Ag3.5

96.5

-

3.5

-

-

-

221

-

-

Industry stardard lead free

Sn42/Bi57.6/Ag0.4

42

-

0.4

-

-

57.6

 

 

138

Lead free low melting point

SACX0307

98.9

-

0.3

0.7

-

0.1

 

217

228

Best in class drop shock reliability

SACX0307 Plus

98.9

-

0.3

0.7

 

0.1

 

217

228

MaxRel

 

Proprietary

212 220

Best in class thermal cycle reliability and drop shock
performance

MaxRel Plus

209 220

 

HRL1

138 151

Best in class thermal cycle reliability and drop shock
low temperature alloy

  
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