RF Packages

The latest technologies to drive thermally efficient and RF consistent packaging reliability provide overall package size and cost reductions to meet your needs.

 

Alpha Advanced Materials provides materials for RF communication and industrial applications serving low power, wireless infrastructure, broadcast, commercial aerospace, mobile radio communication, industrial, scientific and medical (ISM), consumer and commercial cooking and defense markets.  With materials exceeding thermal conductivities of previous industry standards for LDMOS, SIGe, GaAs and GaN technologies.  Alpha material solutions are available today meet tomorrows RF application challenges, including reduction in overall system cost, form factor size reduction and simplified system design. Alpha provides the materials and support required to enable our customers to create market leading package designs.

Conductive Die Attach

Product Name Format Deposition Method Thermal (W/m-k) Key Features Component Type
Water Lamination Dispense Print Bare Silicon Compatibility Modulus
ATROX®
850HT1
Paste   o   Extreme Mid QFN, BGA, SO, TO
ATROX®
800HT2V
Paste   o o Extreme   Mid QFN, SO, TO, TSSO, Cu Clip
ATROX®
800HT5
Paste   o   High o Low QFN, SO, TO, TSSO, LGA, QFP


Getter

Product Name Format Deposition Method Activation Require Getter Type Application
Pick & Place Dispense Print Hydrogen Moisture Particle
STAYDRY® H2- 3000 Film o     o o o   Hi Rel Hermetic Packages: Deefense, Military, Aerospace, Telecom
HiCap™
2000
Paste   o o     o   Hi Rel Hermetic Packages: Military, Defense, Telecom and Medical
STAYDRY® GA2000-2 Paste   o o o   o o Hi Rel Hermetic Packages: Military, Defense, Aerospace and Telecom
STAYDRY® Z20 Film

o   o
Hi Rel Hermetic Packages: Military, Defense, Aerospace and Telecom


Conductive Polymer

Product Name Format Deposition Method Property Application
Water Lamination Pick & Place Dispense Print Reworkable  Thermal  (W/m-k) Tg 
STAYSTIK® 181AK Paste     o o o Low Mid Lid seal,  substrate attach
STAYSTIK® 8000 Film o o       Low High Low Temp lamination, substrate, backplane attach


Paste flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Actiivty Vicosity Tackiness
NCX-390 No Clean o   o o Hi Med Hi BGA/FCCSP
NCX-402-M3 Water  Soluble
  o o Hi Med Hi BGA/FCCSP


Solder paste

Product Name Material Type Deposition Method Properties Powder Size Component Type
Dispense Print Dip Halide Free Activity Tackiness Fine Pitch Capable Lead Free Type 3 Type 4 Type 5 Type 6
NCP1213 No Clean o     o Hi Hi     o       Leadframe
NCP-390     o   o Hi Hi o o   o o o SiP/BGA
WS693CPS Water Soluble   o   o Hi Hi o o   o o o SiP/BGA
WS698CPS Water Soluble   o   o Hi Hi o o  

o SiP/BGA


Sphere

 

 

Alloy

Elemental Composition

Melting Point (C)

 

Atttribute

Tin (Sn)

Lead (Pb)

Silver (Ag)

Copper (Cu)

Nickel (Ni)

Bismuth (Bi)

 

Eutectic

 

Solidus

 

Liquidus

 

Tin- Lead

Sn63/Pb37

63

37

-

-

-

-

183

-

-

Eutectuc Tin-lead

Sn62/Pb36/Ag2

62

36

2

-

-

-

179

-

-

Eutectuc Tin-lead Silver

 

 

 

 

 

Lead Free

SAC105

98.5

-

1

0.5

-

-

 

217

228

 

Industry standard low silver alloy

SAC125 w/Ni

98.3

-

1.2

0.5

250-500
ppm

-

 

217

228

SAC305

96.5

-

3

0.5

-

-

 

217

221

Industry stardard lead free

SAC405

95.5

-

4

0.5

-

-

 

217

225

Industry stardard lead free

Sn96.5/Ag3.5

96.5

-

3.5

-

-

-

221

-

-

Industry stardard lead free

Sn42/Bi57.6/Ag0.4

42

-

0.4

-

-

57.6

 

 

138

Lead free low melting point

SACX0307

98.9

-

0.3

0.7

-

0.1

 

217

228

Best in class drop shock reliability

SACX0307 Plus

98.9

-

0.3

0.7

 

0.1

 

217

228

MaxRel

 

Proprietary

212 220

Best in class thermal cycle reliability and drop shock
performance

MaxRel Plus

209 220

 

HRL1

138 151

Best in class thermal cycle reliability and drop shock
low temperature alloy

  
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