Product Overview

ALPHA High Lead Die Attach Preforms are constructed with 99.99% (4N) purity PbSn, PbSnAg, PbSb alloys.

In order to minimize oxidation during storage and shipping, these products are packaged in glass jars flooded with Argon, and are hermetically sealed. These products are typically reflowed with forming gas at very high reflow temperatues.

Shapes include disc, squares, rectangles.  These preforms are available in a wide range of sizes, specifically for die attach applications.

 

 

 

 

 

Product Features

  • 99.99% (4N) purity, High Pb containing alloys
  • Hermetically sealed package with Argon
  • 50um and thicker standard 
  • Discs, squares and rectangular shapes
     
high Lead capacitors

4N Purity High Pb Alloys for Die Attach

Chart of High Lead Preform alloys and melting temp

        * Other alloys available - contact us.

Related Products

PRODUCT TYPE PRODUCT NAME COMPATIBLE SURFACE FINISH PRODUCT APPLICATION METHOD END APPLICATION
Bond line Control Preforms ALPHA TrueHeight Preforms All solderable surfaces Pick & Place Clip Attach / Substrate Attach
PB-free, High temp. Alloy Preforms ALPHA PowerBond Preforms All solderable surfaces Pick & Place Substrate Attach / Module Attach
Innolot Alloy Preforms ALPHA Innolot Preforms All solderable surfaces Pick & Place Substrate Attach / Other

 

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