AAM Presenting at MiNaPAD 2018

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AAM Presenting at MiNaPAD 2018

Our Colin McLean will be presenting a paper 'A low Temperature Curing Hybrid Silver Sintering Die Attach Paste for High Reliability Power Semiconductor Applications' at MiNaPAD Forum 2018.

It will be Wednesday May 16th on Session B. Refer the pdf file here

MiNaPAD


  
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