Chip on Wafer

Portable mobile devices is growing rapidly together with the growth of Internet of Things technology this is driving the demand for both increased functional intergration as well as increased packaging complexity and sophistication.  To accerlerate  package performance, conventional interconnect technology  is shifting from 2D packaging to more advanced 2.5D and 3D packaging.

To meet this requirement,  stacking integration technologies are being used to combine multiple chips with diverse functionality  such as flip chip into silicon stack dies or die on wafers. Alpha flux technology offers 2.5D and 3D die stacking solutions either through conventional mass reflow methods or thermo-compression bonding. Alpha flux provide robust soldering solutions for both flip chip with copper pillar bumps and micro-bumps

Paste flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Vicosity Tackiness
NCX No Clean o   o   Lo Med Hi BGA/FCCSP
NCX-390 o   o o Hi Med Hi BGA/FCCSP
NCX-FD o   o   Hi Med Hi BGA/FCCSP
POP707     o o Hi Lo Hi BGA/FCCSP/POP
NCX PRL-505 Epoxy o o o   Lo Hi Hi BGA/FCCSP/Wafer
WS3018-HA Water  Soluble o o o   Lo Med Hi FCCSP
WS3018-LV   o o   Lo Lo Lo FCCSP
WS5018-HA o   o   Hi Med Hi FCCSP


Liquid Flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Dispense Print Dip Spray Halide Free Activity Tackiness Low Residue
NCX-009 No Clean           o Lo Lo o Wafer/FCCSP 
WS3018-FS Water Soluble   o     o   Hi Lo   FCCSP
  
*
(Press ctrl to select multiple)
*