Thermal Management

Alpha Advanced Materials offers a full line of thermoplastic and thermosetting polymer bonding products for thermal management of semiconductor and electronics applications . These products cover a complete range of mechanical, electrical and thermal properties and be used for temporary mounting or permanent bonding. Specific enabling products support stringent industry reliability standards; including JEDEC and MIL specification. Alpha Advanced Materials' thermal management products are the premier choice for all of your high performance bonding applications.

Conductive Polymer

Product Name Format Deposition Method Property Application
Reworkable  Thermal  (W/m-k) Tg 
Water Lamination Pick & Place Dispense Print
STAYSTIK® 181AK Paste     o o o Low Mid Lid seal,  substrate attach
STAYSTIK® 8000 Film o o       Low High Low Temp lamination, substrate, backplane attach
POLYSOLDER SE3001 Paste     o o   Medium Mid Substrate attach, DCA. COB attach, Lid seal
STAYSTIK® 571 Film o o     o Low Low Substrate, backplane attatch
STAYSTIK® 581 Film o o     o Low Mid Substrate, back plane attach


Non Conductive Polymer

Product Name Format Deposition Method Reworkable  Application
Water Lamination Pick & Place Dispense Spin Coat Dippable Print
STAYCHIP® F6142 Paste     o     o   Lid attach,


Conductive Die Attach

Product Name Format Deposition Method Thermal (W/m-k) Key Features Component Type
Water Lamination Dispense Print Bare Silicon Compatibility Modulus
ATROX®
800HT2		 Paste   o   High   High SO, TO, QFN, TSSO 
ATROX®
800HT2V		 Paste   o o Extreme   Mid QFN, SO, TO, TSSO, Cu Clip
ATROX®
800HT5		 Paste   o   High o Low QFN, SO, TO, TSSO, LGA, QFP
  
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