Wafer bumping technology provide high performance, form factor and cost advantages in a smallest semiconductor package.
The solder bumps used in wafer level packaging need to demonstrate both high electrical and high mechanical reliability during the lifetime of the product. Alpha Solder spheres, Paste fluxes offer industry leading wafer ball attach solution to meet those requirement. Alpha liquid fluxes provide robust wafer bump reforming processes for wafer bumping applications that utilize electroplated solder bumping processes.
Paste Flux
| Product Name |
Material Type |
Deposition Method |
Properties |
Component Type |
| Pin Transfer |
Print |
Dip |
Halide Free |
Activity |
Vicosity |
Tackiness |
| WS600-MHV |
Water Soluble |
o |
o |
o |
o |
Hi |
Hi |
Hi |
BGA/wafer |
| WS9180-MHV |
o |
o |
o |
o |
Hi |
Hi |
Hi |
BGA/wafer |
| WSX-HF-HAHV |
o |
o |
o |
o |
Hi |
Hi |
Hi |
BGA/wafer |
| WS9160-M7 |
o |
o |
o |
o |
Hi |
Med |
Hi |
BGA/wafer |
Liquid Flux
| Product Name |
Material Type |
Deposition Method |
Properties |
Component Type |
| Dispense |
Spray |
Dip |
Halide Free |
Activity |
Tackiness |
Low Residue |
| NR310B |
No Clean |
o |
o |
|
|
Lo |
Lo |
|
wafer |
| OA5304HF |
Water Soluble |
o |
o |
|
o |
Hi |
Hi |
o |
wafer |
| OA1303 |
o |
o |
|
o |
Hi |
Hi |
o |
wafer |
Sphere
|
|
Alloy
|
Elemental Composition
|
Melting Point (C)
|
Atttribute
|
|
Tin (Sn)
|
Lead (Pb)
|
Silver (Ag)
|
Copper (Cu)
|
Nickel (Ni)
|
Bismuth (Bi)
|
Eutectic
|
Solidus
|
Liquidus
|
|
Tin- Lead
|
Sn63/Pb37
|
63
|
37
|
-
|
-
|
-
|
-
|
183
|
-
|
-
|
Eutectuc Tin-lead
|
|
Sn62/Pb36/Ag2
|
62
|
36
|
2
|
-
|
-
|
-
|
179
|
-
|
-
|
Eutectuc Tin-lead Silver
|
|
Lead Free
|
SAC105
|
98.5
|
-
|
1
|
0.5
|
-
|
-
|
|
217
|
228
|
Industry standard low silver alloy
|
|
SAC125 w/Ni
|
98.3
|
-
|
1.2
|
0.5
|
250-500
ppm
|
-
|
|
217
|
228
|
|
SAC305
|
96.5
|
-
|
3
|
0.5
|
-
|
-
|
|
217
|
221
|
Industry stardard lead free
|
|
SAC405
|
95.5
|
-
|
4
|
0.5
|
-
|
-
|
|
217
|
225
|
Industry stardard lead free
|
|
Sn96.5/Ag3.5
|
96.5
|
-
|
3.5
|
-
|
-
|
-
|
221
|
-
|
-
|
Industry stardard lead free
|
|
Sn42/Bi57.6/Ag0.4
|
42
|
-
|
0.4
|
-
|
-
|
57.6
|
|
|
138
|
Lead free low melting point
|
|
SACX0307
|
98.9
|
-
|
0.3
|
0.7
|
-
|
0.1
|
|
217
|
228
|
Best in class drop shock reliability
|
|
SACX0307 Plus
|
98.9
|
-
|
0.3
|
0.7
|
|
0.1
|
|
217
|
228
|
|
MaxRel
|
Proprietary
|
|
212 |
220 |
Best in class thermal cycle reliability and drop shock
performance
|
|
MaxRel Plus
|
|
209 |
220 |
|
HRL1
|
|
138 |
151 |
Best in class thermal cycle reliability and drop shock
low temperature alloy
|