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Conductive Die Attach
ATROX 800HT5
ATROX 800HT5
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Atrox_Novel Conductive paste Using Hybrid Silver Sintering Technology
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Features & Benefits
High Thermal Conductivity
>
70 W/m-K
Lower stress material for mid to larger size die packages (< 50mm
2
)
Compatible with multiple lead-frame surfaces: Ag, Cu & PPF (NiPdAu)
Compatible with Bare Si and metalized die surfaces
High through put dot and pattern dispense capable with excellent workability across all leadframe designs
Minimal voiding with medium up to large die on various leadframe / component finishes.
Excellent reliability properties and able to pass MSL2A conditions
Compatible with either nitrogen or air cure conditions
Application Methods
Syringe / Shower Head Dispense
Screen / Stencil Print
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