Features & Benefits

  • High Thermal Conductivity > 70 W/m-K
  • Lower stress material for mid to larger size die packages (< 50mm2)
  • Compatible with multiple lead-frame surfaces: Ag, Cu & PPF (NiPdAu)
  • Compatible with Bare Si and metalized die surfaces
  • High through put dot and pattern dispense capable with excellent workability across all leadframe designs
  • Minimal voiding with medium  up to large die on various leadframe / component finishes.
  • Excellent reliability properties and able to pass MSL2A conditions
  • Compatible with either nitrogen or air cure conditions

Application Methods

  • Syringe / Shower Head Dispense
  • Screen / Stencil Print
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