ATROX 800HT5

Features & Benefits

• High Thermal Conductivity > 70 W/m-K
• Lower stress material for mid to larger size die packages (< 50mm²)
• Compatible with multiple lead-frame surfaces: Ag, Cu & PPF (NiPdAu)
• Compatible with Bare Si and metalized die surfaces
• High through put dot and pattern dispense capable with excellent workability across all leadframe designs
• Minimal voiding with medium  up to large die on various leadframe / component finishes.
• Excellent reliability properties and able to pass MSL2A conditions
• Compatible with either nitrogen or air cure conditions

Application Methods

• Syringe / Shower Head Dispense
• Screen / Stencil Print