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Conductive Die Attach
ATROX CF2001D
ATROX CF200-1D
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Atrox Novel Conductive paste Using Hybrid Silver Sintering Technology
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Features & Benefits
Excellent High Conductive Film Thermal Conductivity
>
20 W/m-K
Produces high thermal and electrical conductivity silver bond with conventional die attach film processes
Can be laminated on wafer backside with moderate temperatures (< 80C) and pressures (< 30N)
Has excellent flexibility and applicable for thin power semiconductor wafer designs
Low stress material for small to medium size die packages (< 25mm
2
)
Compatible with Bare Si and metalized die surfaces with excellent workability across all leadframe designs
Can achieve uniform bond line thickness and minimum flow compared with conductive pastes
Lower attach and cure temperatures for exposed pad packages
Ultra Low voiding on small to medium size die on various leadframe / component finishes.
High reliability properties and able to pass MSL3 conditions
Compatible with either nitrogen or air cure conditions
Application Methods
Die Attach Film Lamination
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