ATROX HT900-6B

Features & Benefits

• High Thermal Conductivity > 90 W/m-K
• Ultra-Low stress material for larger size die packages (> 50mm²)
• Compatible with multiple lead-frame surfaces: Ag, Cu & PPF (NiPdAu)
• Compatible with Bare Si and metalized die surfaces
• High through put pattern dispense capable with excellent workability across all leadframe designs
• Ultra-Low voiding on larger die on various leadframe / component finishes.
• Excellent reliability properties and able to pass MSL3 conditions
• Compatible with either nitrogen or air cure conditions

Application Methods

• Syringe Dispense
• Screen / Stencil Print