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Conductive Die Attach
ATROX HT900-6B
ATROX HT900-6B
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Atrox Novel Conductive paste Using Hybrid Silver Sintering Technology
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Features & Benefits
High Thermal Conductivity
>
90 W/m-K
Ultra-Low stress material for larger size die packages (> 50mm
2
)
Compatible with multiple lead-frame surfaces: Ag, Cu & PPF (NiPdAu)
Compatible with Bare Si and metalized die surfaces
High through put pattern dispense capable with excellent workability across all leadframe designs
Ultra-Low voiding on larger die on various leadframe / component finishes.
Excellent reliability properties and able to pass MSL3 conditions
Compatible with either nitrogen or air cure conditions
Application Methods
Syringe Dispense
Screen / Stencil Print
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