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Conductive Die Attach
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FEATURES AND BENEFITS
Long Stencil Life: consistent performance for at least 8 hours of continuous printing without addition of newpaste
Long, High Tack Force Life: ensures high pick-and-place yields, good self-alignment
Wide Reflow Profile Window: allows best quality solderability of complicated, high density PWB assemblies inboth air and nitrogen reflow, using ramp and soak profiles, as high as 175 to 185°C
Reduced Random Solder Ball Levels: minimizes rework and increases first time yield
Excellent Coalescence and Wetting Performance: coalesced 180μm circle deposit, even at high soak profileenvironment
Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering, even using long/high thermalsoaking, without charring or burning
Excellent Voiding Performance: Meets IPC7095 Class III Requirement
Halogen Content: Zero Halogen, no halogen intentionally added
Residue: Excellent Pin Testing property and Pass JIS Copper Corrosion Test
Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free requirements (see tablebelow), as well as TOSCA & EINECS
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