• Long Stencil Life: consistent performance for at least 8 hours of continuous printing without addition of newpaste
  • Long, High Tack Force Life: ensures high pick-and-place yields, good self-alignment
  • Wide Reflow Profile Window: allows best quality solderability of complicated, high density PWB assemblies inboth air and nitrogen reflow, using ramp and soak profiles, as high as 175 to 185°C
  • Reduced Random Solder Ball Levels: minimizes rework and increases first time yield
  • Excellent Coalescence and Wetting Performance: coalesced 180μm circle deposit, even at high soak profileenvironment
  • Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering, even using long/high thermalsoaking, without charring or burning
  • Excellent Voiding Performance: Meets IPC7095 Class III Requirement
  • Halogen Content: Zero Halogen, no halogen intentionally added
  • Residue: Excellent Pin Testing property and Pass JIS Copper Corrosion Test
  • Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free requirements (see tablebelow), as well as TOSCA & EINECS
(Press ctrl to select multiple)