Features & Benefits

  • Good activity allows for excellent soldering to ENIG and Cu OSP for flip chip process
  • Superior wetting maximizing assembly yields for flip chip
  • Excellent cleanability performance in that residues are easily cleaned with DI water temperatures from 30 – 60ºC
  • Compatible with WS3018-FS for dip and spray combo proces


Application Methods

  • Chip / small package dippable
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