• Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
  • Superior wetting maximizing assembly yields to provide lowest missing ball rates
  • Excellent material stability whereas the flux maintains tack and viscosity over multiple print cycles
  • Excellent clean-ability performance in that residues are easily cleaned with DI water
  • Capable for Thermocompression bonding and Laser Assist bonding process
  • IPC Halogen free formulation
  
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