Features & Benefits

  • Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
  • Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates
  • Excellent material stability whereas the flux maintains tack and viscosity over multiple print cycles (without replenishment up to 8 hours)
  • Excellent cleanability performance in that residues are easily cleaned with DI water
  • IPC Halogen free formulation
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