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Conductive Die Attach
Solder Paste
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Low Temperature Alloys
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Ultra Fast Sintering
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Head in Pillow Defect
Non-Wet Open
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FEATURES AND BENEFITS
Excellent Wettability
Excellent Cleanability
Halide-free Formulation
Excellent material stability – maintains viscosity tack and viscosity over time
Can be used in nitrogen or air environments
Wide process window for maximum application flexibility
Excellent print and pin-transfer stability
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