WSX-9284

FEATURES AND BENEFITS
  • Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
  • Excellent activity allows for pristine, and oxide free pre-cleaning of Cu-OSP soldering pads
  • Superior wetting maximizing assembly yields to provide lowest missing ball rates
  • Excellent material stability whereas the flux maintains tack and viscosity over multiple print cycles (without replenishment)
  • Excellent clean-ability performance in that residues are easily cleaned with DI water
  • IPC Halogen free formulation

  
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