Alpha Advanced Materials offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications.
Alpha Advanced Materials no-clean and water-soluble solder pastes for component attach, die-attach and wafer bumping applications meet challenging lead-free and eutectic processing needs. These products were developed to deliver excellent printing and dispensing performance, while maximizing process throughput and yield.