• Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as200μm (8 mil) with 100μm (4 mil) thick stencils
  • Excellent print consistency with high process capability index across all board designs.
  • Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput.
  • Wide reflow profile window with good solderability on various board / component finishes.
  • Excellent solder and flux cosmetics after reflow soldering
  • Best in class low defect rate for Head in Pillow
  • Best in class in circuit pin test yield
  • Reduction in random solderballing levels, minimizing rework and increasing first time yield
  • Meets highest IPC 7095 voiding performance classification of Class III
  • Excellent reliability properties, halide-free material
  • Compatible with either nitrogen or air reflow
  • Zero halogen (No halogen intentionally added to the formulation)
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