Spheres

Alpha Advanced Materials spheres caters for ball grid array (BGA), chip scale packages (CSP) and flip chip bumping applications,. We can meet your solder sphere specifications with a wide range of lead-free, eutectic, high lead and custom alloys available in a variety of common diameters. ALPHA® spheres are made to the highest quality control standards to assure consistent sphere size, uniformity and alloy content.

Type Alloy Alloy Tin(Sn) Lead
(Pb)		 Silver (Ag) Bismuth (Bi) Copper (Cu) Melting Point (oC) Attributes
Eutectic Solidus Liquidus
Lead Free Standard Sn96.5/Ag3.5 96.5 -- 3.5 -- -- 221 -- -- Eutectic Tin-Silver
SAC405 95.5 -- 4.0 -- 0.5 -- 217 225 Industry Standard Lead-Free
SAC305 96.5 -- 3.0 -- 0.5 -- 217 221 Industry Standard Lead-Free
SAC125 98.3 -- 1.2 -- 0.5 -- 217 228 Low-Silver Lead-Free alloys for optimal drop-shock resistance (SACX contain Proprietary materials) 
SAC105 98.5 -- 1.0 -- 0.5 -- 217 228
High Reliability SACX Plus®
 		Modified SAC0307 Alloy -- 217 228
Maxrel® Modified SAC -- 212 220 High thermal cycle resistance and better than standard drop shock performance
Maxrel® Plus  Modified (Sb Free) -- 211 216
Low Temperature Sn42/Bi57.6/Ag0.4  42 --
 0.4  57.6 --
138 -- -- Lead free low melting point
Tin Lead
Sn62/Pb36/Ag2 62 36 2.0 -- -- 179 -- -- Eutectic Tin-Lead-Silver
Sn63/Pb37 63 37 -- -- -- 183 -- -- Eutectic Tin-Lead
  
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