Drop Shock

With the ever-growing proliferation of portable electronic devices, drop shock resistance has become a major issue.  The solder of lead-free material increases the brittle condition of the solder joint due to its low ductility at both the solder and the interfacial intermetallic compound (IMC) layer.  Alpha’s use of micro-additives improves ductility as well as thermal and mechanical reliability for superior mechanical properties, thermal cycling, and drop shock and creep resistance.

Alpha products that increase drop shock resistance:

Solder Paste

 

Solder Preforms

Size Dimensions Volume Pb-Free Sn-Pb SnBiAg
a b c
inch mm mm mm3
0201 0503 0.51 0.25 0.25 0.032   X  
0201S 0403 0.44 0.28 0.28 0.034 X    
0202 0505 0.51 0.51 0.25 0.065 X X  
03015 0838 0.76 0.38 0.25 0.072   X  
03015S 06035 0.60 0.35 0.35 0.074 X    
0402H 1006H 1.00 0.60 0.25 0.150 X X *
0402 1006 1.00 0.50 0.50 0.250 X X X
0402B 10055 1.00 0.55 0.55 0.303 X X *
0603H 1608H 1.60 0.80 0.50 0.640 X X *
0603 1608 1.60 0.80 0.80 1.024 X X X
0805H 2013H 2.01 1.30 0.40 1.045 X X *
0805 2013 2.01 1.30 0.76 1.986 X X X
0805S 2013S 2.01 1.30 1.30 3.397 X X *
1206 3015 3.00 1.47 0.77 3.396 X X *
1406 3515 3.56 1.52 0.77 4.167 X X *

*production will depend on market demand, please check with your local sales representative for availability

  
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