With the ever-growing proliferation of portable electronic devices, drop shock resistance has become a major issue. The solder of lead-free material increases the brittle condition of the solder joint due to its low ductility at both the solder and the interfacial intermetallic compound (IMC) layer. Alpha’s use of micro-additives improves ductility as well as thermal and mechanical reliability for superior mechanical properties, thermal cycling, and drop shock and creep resistance.